Stage apparatus, exposure apparatus, and exposure method

ABSTRACT

An exposure apparatus has a stage having a substrate holder and a plate member around the substrate holder to surround a substrate on the substrate holder. A liquid supply mechanism includes a supply port above the stage at a more outward position than an optical path of light from a projection system and supplies liquid onto the stage from the supply port. A liquid recovery mechanism includes a recovery port above the stage at a more outward position than the supply port and recovers the liquid supplied from the supply port. The liquid supply and recovery mechanisms form a liquid immersion region that includes the optical path on part of the stage with the liquid supplied from the supply port. The stage has a passageway below the plate member and recovers the liquid from the liquid immersion region that infiltrates a gap between the plate member and the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of U.S. patent application Ser. No. 12/926,763filed Dec. 8, 2010, which in turn is a continuation of U.S. patentapplication Ser. No. 10/582,268 filed Jun. 9, 2016 (now U.S. Pat. No.7,982,857), which is the U.S. National Stage of InternationalApplication No. PCT/JP2004/018702 filed Dec. 15, 2004, which claimspriority to Japanese Patent Application No. 2003-416712 filed Dec. 15,2003. The disclosure of each of the above-identified applications isincorporated herein by reference in its entireties.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a stage apparatus having a holder thatholds a substrate as well as a stage that supports and moves the holder,an exposure apparatus comprising the stage apparatus, and an exposuremethod; more particularly, the present invention relates to a stageapparatus, an exposure apparatus, and an exposure method suited for usewhen exposing a substrate with an image of a pattern through aprojection optical system and a liquid. In addition, the disclosure ofthe following priority application is hereby incorporated by referencein its entirety: Japanese Patent Application No. 2003-416712, filed onDec. 15, 2003.

2. Description of the Related Art

Semiconductor devices and liquid crystal display devices are fabricatedby a so-called photolithography technique, wherein a pattern formed on amask is transferred onto a photosensitive substrate.

An exposure apparatus used in this photolithographic process comprises amask stage that supports the mask, as well as a substrate stage thatsupports the substrate, and transfers the pattern of the mask onto thesubstrate through a projection optical system while successively movingthe mask stage and the substrate stage.

There has been demand in recent years for higher resolution projectionoptical systems in order to handle the much higher levels of integrationof device patterns. The shorter the exposure wavelength used and thelarger the numerical aperture of the projection optical system, thehigher the resolution of the projection optical system becomes.Consequently, the exposure wavelength used in exposure apparatuses hasshortened year by year, and the numerical aperture of projection opticalsystems has increased. Furthermore, the mainstream exposure wavelengthcurrently is the 248 nm KrF excimer laser, but an even shorterwavelength 193 nm ArF excimer laser is also being commercialized. Inaddition, as with resolution, the depth of focus (DOF) is important whenperforming an exposure. The following equations express the resolution Rand the depth of focus δ, respectively.

R=k ₁ ·λ/NA   (1)

δ=±k ₂ ·λ/NA ²   (2)

Therein, λ is the exposure wavelength, NA is the numerical aperture ofthe projection optical system, and k₁ and k₂ are the processcoefficients. Equations (1) and (2) teach that if the exposurewavelength λ is shortened and the numerical aperture NA is increased inorder to enhance the resolution R, then the depth of focus δ narrows.

At this time, if the depth of focus δ becomes excessively narrow, thenit will become difficult to align the front surface of the substratewith the image plane of the projection optical system, and there will bea risk of insufficient margin during the exposure operation.

Accordingly, a liquid immersion method has been proposed, as disclosedin, for example, Patent Document 1 below, as a method to substantiallyshorten the exposure wavelength and increase the depth of focus. Thisliquid immersion method forms an immersion area by filling a liquid,such as water or an organic solvent, between the lower surface of theprojection optical system and the front surface of the substrate, thustaking advantage of the fact that the wavelength of the exposure lightin a liquid is 1/n of that in the air (where n is the refractive indexof the liquid, normally about 1.2-1.6), thereby improving the resolutionas well as increasing the depth of focus by approximately n times.

Nevertheless, the related art discussed above has the following types ofproblems.

The abovementioned related art is constituted so that the liquid locallyfills the space between the substrate (wafer) and the end surface on theimage plane side of the projection optical system, and so that theliquid does not flow out to the outer side of the substrate whenexposing a shot region in the vicinity of the center of the substrate.Nevertheless, if an attempt is made to set the projection area 100 ofthe projection optical system to a peripheral area (edge area) E of asubstrate P and then expose the edge area E of the substrate P, asdepicted by the schematic diagram of FIG. 10, there is a problem in thatthe liquid flows out to the outer side of the substrate P, and thereforethe immersion area does not form satisfactorily, which degrades theprojected pattern image. In addition, the liquid that flows out can alsocause problems such as rusting of mechanical parts and the like aroundthe substrate stage that supports the substrate P, as well as electricalleakage of the stage drive system and the like.

Furthermore, if the liquid that flows out to the outer side of thesubstrate P travels around to the rear surface of the substrate P andinfiltrates the space between the substrate P and the substrate stage(substrate holder), then it will also cause a problem wherein thesubstrate stage cannot satisfactorily hold the substrate P. In addition,if the liquid infiltrates the step or the gap between the substrate Pand the substrate stage, then in this case as well there is apossibility that the liquid will cause rust or electric leakage.Particularly if a positioning notched part, such as a notched part andan orientation flat part (orientation flat), is formed in the substrateP, then the gap between the outer circumference of the substrate P andthe table part at the periphery thereof will increase, which willconsequently make it easy for the liquid to travel around through thisgap.

The present invention was made considering the abovementioned problems,and it is an object of the present invention to provide a stageapparatus, an exposure apparatus, and an exposure method that canprevent the infiltration of a liquid into the space between a substrateand a holder, and that can perform exposure in a state wherein animmersion area is satisfactorily formed, even when exposing an edge areaof the substrate.

SUMMARY OF THE INVENTION

To achieve the abovementioned objects, the present invention adopts thefollowing constitution.

The stage apparatus of the present invention comprises a holder, whichhas a substrate holding surface that holds a substrate, and a stage,which supports and moves the holder, comprising: a recovery apparatus,which is disposed in the vicinity of the holder, that has a lyophilicpart, of which at least a part is lyophilic, and that recovers a liquidusing the lyophilic part.

Accordingly, because the lyophilic parts of the stage apparatus of thepresent invention have an affinity for the liquid, it is possible toguide the liquid that infiltrates the vicinity of the holder in adirection away from the substrate holding surface, and then recover theliquid. Consequently, it is possible to prevent the infiltration of theliquid between the substrate holding surface and the rear surface of thesubstrate, and thereby to expose the edge area of the substrate in astate wherein the immersion area is satisfactorily formed.

In addition, an exposure apparatus of the present invention comprises astage apparatus as described in the claims. Furthermore, an exposuremethod of the present invention is to transfer a mask pattern through aprojection optical system onto a substrate on a holder while filling theliquid between the projection optical system and the substrate andperforming an exposure while preventing the infiltration of the liquidinto the space between the substrate holding surface and the rearsurface of the substrate.

With the exposure apparatus and the exposure method of the presentinvention, it is possible to prevent the infiltration of the liquid intothe space between the substrate holding surface and the rear surface ofthe substrate, even when filling the liquid between the projectionoptical system and the substrate and exposing the edge area of thesubstrate. Accordingly, it is possible to perform an exposure whilesatisfactorily holding the substrate.

With the present invention, the liquid can be prevented from travelingaround to the space between the substrate and the holder, even whenexposing the edge area of the substrate, and it is thereby possible toperform an immersion exposure while satisfactorily holding the liquidbelow the projection optical system.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram that depicts one embodiment of anexposure apparatus according to the present invention.

FIG. 2 is a schematic block diagram that depicts a liquid supplymechanism and a liquid recovery mechanism.

FIG. 3 is a plan view of a substrate stage.

FIG. 4 is a cross sectional view of principle parts of the substratestage according to the first embodiment.

FIG. 5 is a cross sectional view of principle parts of the substratestage according to the second embodiment.

FIG. 6 is an enlarged plan view of the substrate stage according to thesecond embodiment.

FIG. 7 is a cross sectional view of principle parts of the substratestage according to the third embodiment.

FIG. 8 is a cross sectional view of principle parts of the substratestage according to another embodiment.

FIG. 9 is a flow chart diagram that depicts one example of a process offabricating a semiconductor device.

FIG. 10 is a schematic diagram for explaining the problems with theconventional exposure method.

DETAILED DESCRIPTION OF THE INVENTION

The following explains the embodiments of the stage apparatus and theexposure apparatus of the present invention, referencing FIG. 1 throughFIG. 9. FIG. 1 is a schematic block diagram that depicts one embodimentof the exposure apparatus according to the present invention.

First Embodiment

In FIG. 1, an exposure apparatus EX comprises: a mask stage MST thatsupports a mask M; a substrate stage PST that supports a substrate P; anillumination optical system IL that illuminates the mask M, which issupported by the mask stage MST, with an exposure light EL; a projectionoptical system PL that projects and exposes a pattern image of the maskM illuminated by the exposure light EL onto the substrate P supported bythe substrate stage PST, which functions as the stage apparatus; and acontrol apparatus CONT that provides overall control of the operation ofthe entire exposure apparatus EX.

The exposure apparatus EX of the present embodiment is a liquidimmersion type exposure apparatus that applies the liquid immersionmethod to substantially shorten the exposure wavelength, improve theresolution, as well as substantially increase the depth of focus, andcomprises a liquid supply mechanism 10 that supplies a liquid 1 betweenthe projection optical system PL and the substrate P, and a liquidrecovery mechanism 20 that recovers the liquid 1 on the substrate P. Inthe present embodiment, pure water is used as the liquid 1. At leastduring the transfer of the pattern image of the mask M onto thesubstrate P, the exposure apparatus EX forms an immersion area AR2 withthe liquid 1, which is supplied by the liquid supply mechanism 10, in atleast one part on the substrate P that includes a projection area AR1 ofthe projection optical system PL. Specifically, the exposure apparatusEX exposes the substrate P by filling the liquid 1 between an opticalelement 2 at the tip part of the projection optical system PL and thefront surface (exposure surface) PA (refer to FIG. 4) of the substrateP, and then projecting the pattern image of the mask M onto thesubstrate P through the projection optical system PL and the liquid 1which is provided between this projection optical system PL and thesubstrate P.

The present embodiment will now be explained as exemplified by a case ofusing a scanning type exposure apparatus (a so-called scanning stepper)as the exposure apparatus EX that exposes the substrate P with thepattern formed on the mask M while synchronously moving the mask M andthe substrate P in their respective scanning directions in mutuallydifferent orientations (reverse directions). In the followingexplanations, the direction that coincides with an optical axis AX ofthe projection optical system PL is the Z axial direction, the directionin which the mask M and the substrate P synchronously move (in thescanning directions) within the plane perpendicular to the Z axialdirection is the X axial direction, and the direction perpendicular tothe Z axial direction and the X axial direction (non-scanning direction)is the Y axial direction. In addition, the directions around the X, Y,and Z axes are the θX, θY, and θZ directions, respectively. Furthermore,“substrate” herein includes a semiconductor wafer coated with aphotoresist, which is a photosensitive material, and “mask” includes areticle wherein a device pattern, which is reduction projected onto thesubstrate, is formed.

The illumination optical system IL illuminates the mask M, which issupported by the mask stage MST, with the exposure light EL, andcomprises: an exposure light source; an optical integrator thatuniformizes the illuminance of the luminous flux emitted from theexposure light source; a condenser lens that condenses the exposurelight EL from the optical integrator; a relay lens system; and avariable field stop that sets an illumination region on the mask Milluminated by the exposure light EL to be slit shaped; and the like.The illumination optical system IL illuminates the prescribedillumination region on the mask M with the exposure light EL, which hasa uniform illuminance distribution. Examples of light that can be usedas the exposure light EL emitted from the illumination optical system ILinclude: deep ultraviolet light (DUV light), such as the bright lines(g, h, and i lines) in the ultraviolet region emitted from a mercurylamp for example, and KrF excimer laser light (248 nm wavelength); andvacuum ultraviolet light (VUV light), such as ArF excimer laser light(193 nm wavelength) and F₂ laser light (157 nm wavelength). ArF excimerlaser light is used in the present embodiment. As discussed above, theliquid 1 in the present embodiment is pure water, and the exposure lightEL can transmit therethrough even if it is light from an ArF excimerlaser. In addition, deep ultraviolet light (DUV light), such as KrFexcimer laser light (248 nm wavelength) and the bright lines (g, h, andi lines) in the ultraviolet region, can also transmit through purewater.

The mask stage MST supports the mask M and is two dimensionally movablein the plane perpendicular to the optical axis AX of the projectionoptical system PL, i.e., in the XY plane, and is finely rotatable in theθZ direction. A mask stage drive apparatus MSTD, such as a linear motor,drives the mask stage MST. The control apparatus CONT controls the maskstage drive apparatus MSTD. A movable mirror 50 is provided on the maskstage MST. In addition, a laser interferometer 51 is provided at aposition opposing the movable mirror 50. The laser interferometer 51measures in real time the position in the two dimensional direction aswell as the rotational angle of the mask M on the mask stage MST, andoutputs these measurement results to the control apparatus CONT. Thecontrol apparatus CONT drives the mask stage drive apparatus MSTD basedon the measurement results of the laser interferometer 51, therebypositioning the mask M, which is supported by the mask stage MST.

The projection optical system PL projects and exposes the pattern of themask M onto the substrate P at a prescribed projection magnification β,and comprises a plurality of optical elements, which includes theoptical element (lens) 2 provided at the tip part on the substrate Pside, that is supported by a lens barrel PK. In the present embodiment,the projection optical system PL is a reduction system that has aprojection magnification β for example, ¼ or ⅕. Furthermore, theprojection optical system PL may be a unity magnification system or anenlargement system. In addition, the optical element 2 at the tip partof the projection optical system PL of the present embodiment isdetachably (replaceably) provided to the lens barrel PK, and the liquid1 of the immersion area AR2 contacts the optical element 2.

The optical element 2 is made of fluorite. Because fluorite has a strongaffinity for water, the liquid 1 can adhere to substantially the entiresurface of a liquid contact surface 2 a of the optical element 2.Namely, because the liquid (water) 1 supplied in the present embodimenthas a strong affinity for the liquid contact surface 2 a of the opticalelement 2, the liquid contact surface 2 a of the optical element 2 andthe liquid 1 have strong adhesion, and therefore the optical pathbetween the optical element 2 and the substrate P can be reliably filledwith the liquid 1. Furthermore, the optical element 2 may be made ofquartz, which also has a strong affinity (hydrophilic) for water. Inaddition, the liquid contact surface 2 a of the optical element 2 may begiven hydrophilic (lyophilic) treatment in order to further raise itsaffinity for the liquid 1. In addition, because the vicinity of the tipof the lens barrel PK contacts the liquid (water) 1, at least thevicinity of the tip is made of a metal that is rust resistant, such asTi (titanium).

The substrate stage PST supports the substrate P and comprises: asubstrate table (stage) 52 that holds the substrate P via a substrateholder PH; an XY stage 53 that supports the substrate table 52; and abase 54 that supports the XY stage 53. A substrate stage drive apparatusPSTD, such as a linear motor, drives the substrate stage PST. Thesubstrate stage drive apparatus PSTD is controlled by the controlapparatus CONT. The position in the Z axial direction (the focusposition) and in the θX and θY directions of the substrate P held on thesubstrate table 52 is controlled by driving the substrate table 52. Inaddition, the position of the substrate P in the X and Y directions (theposition in the directions substantially parallel to the image plane ofthe projection optical system PL) is controlled by driving the XY stage53. In other words, the substrate table 52 functions as a Z stage thatcontrols the focus position and the inclination angle of the substrateP, and aligns the front surface of the substrate P with the image planeof the projection optical system PL by an auto focus system and an autoleveling system; further, the XY stage 53 positions the substrate P inthe X axial direction and Y axial direction. Furthermore, the substratetable 52 and the XY stage 53 may of course be integrally provided.

Movable mirrors 55 are provided on the substrate stage PST (thesubstrate table 52). In addition, a laser interferometer 56 is providedat a position opposing each movable mirror 55. The laser interferometers56 measure in real time the position in the two dimensional directionsas well as the rotational angle of the substrate P on the substratestage PST, and output these measurement results to the control apparatusCONT. The control apparatus CONT drives the substrate stage driveapparatus PSTD based on the measurement results of the laserinterferometers 56, and thereby positions the substrate P supported onthe substrate stage PST.

In addition, a ring shaped plate part 30 is provided on the substratestage PST (substrate table 52) so that it surrounds the substrate P. Theplate part 30 is fixed in a state that the outer circumference of theplate part 30 is mated to the substrate table 52, and a recessed part 32is formed on the inner side of the plate part 30. Furthermore, the platepart 30 and the substrate table 52 may be provided integrally. Thesubstrate holder PH that holds the substrate P is disposed in therecessed part 32 (refer to FIG. 4). The plate part 30 has a flat surfacethat is at a height substantially the same as the front surface PA ofthe substrate P, which is held by the substrate holder PH disposed inthe recessed part 32. Furthermore, the details of the plate part 30 andthe substrate holder PH will be discussed later.

The liquid supply mechanism 10 supplies the prescribed liquid 1 onto thesubstrate P, and comprises: a first liquid supply part 11 and a secondliquid supply part 12 that are capable of supplying the liquid 1; afirst supply member 13, which is connected to the first liquid supplypart 11 via a supply pipe 11A having a passageway, that comprises asupply port 13A that supplies the liquid 1 fed from this first liquidsupply part 11 onto the substrate P; and a second supply member 14,which is connected to the second liquid supply part 12 via a supply pipe12A having a passageway, that comprises a supply port 14A that suppliesthe liquid 1 fed from this second liquid supply part 12 onto thesubstrate P. The first and second supply members 13, 14 are disposedproximate to the front surface of the substrate P, and are provided atmutually different positions in the surface directions of the substrateP. Specifically, the first supply member 13 of the liquid supplymechanism 10 is provided on one side (the −X side) of the projectionarea AR1 in the scanning direction, and the second supply member 14 isprovided on the other side (the +X side).

Each of the first and second liquid supply parts 11, 12 comprises atank, which stores the liquid 1, a pressure pump, and the like, andsupplies the liquid 1 onto the substrate P through the supply pipes 11A,12A and the supply members 13, 14. In addition, the liquid supplyoperation of the first and second liquid supply parts 11, 12 iscontrolled by the control apparatus CONT, which is capable ofindependently controlling the amount of liquid 1 supplied per unit oftime by the first and second liquid supply parts 11, 12 onto thesubstrate P. In addition, each of the first and second liquid supplyparts 11, 12 comprises a liquid temperature adjusting mechanism, andsupplies the liquid 1 of a temperature substantially the same as thatinside the chamber wherein the apparatus is housed (e.g., 23° C.) ontothe substrate P.

The liquid recovery mechanism 20 recovers the liquid 1 on the substrateP, and comprises: first and second recovery members 23, 24, whichcomprise recovery ports 23A, 24A disposed proximate to the front surfaceof the substrate P; and first and second liquid recovery parts 21, 22,which are respectively connected to these first and second recoverymembers 23, 24 via recovery pipes 21A, 22A, which have passageways. Eachof the first and second liquid recovery parts 21, 22 comprises: asuction apparatus, such as a vacuum pump; a tank that stores therecovered liquid 1; and the like; further, these first and second liquidrecovery parts 21, 22 recover the liquid 1 on the substrate P via thefirst and second recovery members 23, 24 and the recovery pipes 21A,22A. The liquid recovery operation of the first and second liquidrecovery parts 21, 22 is controlled by the control apparatus CONT, whichis capable of controlling the amount of liquid recovered by the firstand second liquid recovery parts 21, 22 per unit of time.

FIG. 2 is a plan view that schematically depicts the constitution of theliquid supply mechanism 10 and the liquid recovery mechanism 20. Asdepicted in FIG. 2, the projection area AR1 of the projection opticalsystem PL is set to a slit shape (rectangular shape), wherein thelongitudinal direction is in the Y axial direction (the non-scanningdirection), and is formed on a part of the substrate P so that theimmersion area AR2, which is filled with the liquid 1, includes theprojection area AR1. Furthermore, the first supply member 13 of theliquid supply mechanism 10 for forming the immersion area AR2 ,whichincludes the projection area AR1, is provided on one side (the −X side)of the projection area AR1 in the scanning direction, and the secondsupply member 14 is provided on the other side (the +X side).

The first and second supply members 13, 14 are formed substantiallyarcuately in a plan view, and are set so that their supply ports 13A,14A in the Y axial direction are at least larger than the projectionarea AR1 in the Y axial direction. Furthermore, the supply ports 13A,14A, which are formed substantially arcuately in a plan view, aredisposed so that the projection area AR1 is interposed therebetween inthe scanning direction (the X axial direction). The liquid supplymechanism 10 simultaneously supplies the liquid 1 to both sides of theprojection area AR1 via the supply ports 13A, 14A of the first andsecond supply members 13, 14.

The first and second recovery members 23, 24 of the liquid recoverymechanism 20 respectively comprise recovery ports 23A, 24A, which arearcuately and continuously formed so that they face the front surface ofthe substrate P. Furthermore, the first and second recovery members 23,24, which are disposed so that they face one another, form asubstantially annular recovery port. The recovery ports 23A, 24A of thefirst and second recovery members 23, 24 are disposed so that theysurround the first and second supply members 13, 14 of the liquid supplymechanism 10 as well as the projection area AR1. In addition, aplurality of partition members 25 is provided inside the recovery port,which is continuously formed so that it surrounds the projection areaAR1.

The liquid 1 supplied onto the substrate P from the supply ports 13A,14A of the first and second supply members 13, 14 is supplied so that itspreads between the substrate P and the lower end surface at the tippart (optical element 2) of the projection optical system PL. Inaddition, the liquid 1 that flows out to the outer side of the first andsecond supply members 13, 14 with respect to the projection area AR1 isrecovered by the recovery ports 23A, 24A of the first and secondrecovery members 23, 24, which are disposed on the outer side of thefirst and second supply members 13, 14 with respect to the projectionarea AR1.

When performing a scanning exposure of the substrate P in the presentembodiment, the amount of liquid 1 supplied per unit of time from thenear side of the projection area AR1 in the scanning direction is setlarger than that on the opposite side thereof. For example, ifperforming the exposure process while moving the substrate P in the +Xdirection, the control apparatus CONT sets the amount of liquid 1supplied from the −X side of the projection area AR1 (i.e., the supplyport 13A) greater than that from the +X side (i.e., the supply port14A); on the other hand, when performing the exposure process whilemoving the substrate P in the −X direction, the amount of liquid 1supplied from the +X side of the projection area AR1 is set greater thanthat from the −X side. In addition, the amount of liquid 1 recovered perunit of time on the near side of the projection area AR1 with respect tothe scanning direction is set less than that on the opposite side. Forexample, when moving the substrate P in the +X direction, the amount ofliquid 1 recovered from the +X side of the projection area AR1 (i.e.,the recovery port 24A) is greater than that from the −X side (i.e., therecovery port 23A).

FIG. 3 is a plan view of the substrate table 52 of the substrate stagePST, viewed from above. A movable mirror 55 is disposed at each of twomutually perpendicular edge parts of the substrate table 52, which isrectangularly shaped in a plan view. A fiduciary mark FM, which is usedwhen aligning the mask M and the substrate P with respect to aprescribed position, is provided in the vicinity of the intersectionpart of the movable mirrors 55, 55. In addition, although not shown,various sensors, such as illuminance sensors and the like, are providedaround the substrate P on the substrate stage PST.

In addition, a recessed part 32 is circularly formed, in a plan view, atthe substantially center part of the substrate table 52, and a supportpart 52 a is protrudingly provided to this recessed part 32 forsupporting the substrate holder PH (refer to FIG. 4). Furthermore, thesubstrate holder PH, which holds the substrate P, is disposed inside therecessed part 32 in a state wherein the substrate holder PH is supportedby the support part 52 a, and wherein there is a gap between thesubstrate holder PH and the substrate table 52, as depicted in FIG. 4.Furthermore, the pressure in the gap between the substrate table 52 andthe substrate holder PH is set to atmospheric pressure (open).Furthermore, the plate part 30, which has a flat surface 31 that is at aheight substantially the same as the front surface of the substrate P,is provided around the substrate P.

The substrate holder PH comprises a substantially annularcircumferential wall part 33, which holds a rear surface PC of thesubstrate P on the inner side of the outer circumference of thesubstrate P, and a plurality of support parts 34, which are disposed onthe inner side of the circumferential wall part 33, that hold thesubstrate P. The circumferential wall part 33 and the support parts 34are provided on a substantially discoid base part 35, which constitutespart of the substrate holder PH. The support parts 34 are eachtrapezoidal in a cross sectional view, and the rear surface PC of thesubstrate P is held on an upper end surface (substrate holding surface)33A of the circumferential wall part 33 and an upper end surface(substrate holding surface) 34A of each of the plurality of supportparts 34. The support parts 34 are evenly disposed on the inner side ofthe circumferential wall part 33. In the present embodiment, among thesurfaces of the substrate holder PH, the upper end surface 33A of thecircumferential wall part 33 and a side surface 37 are liquid repellent.Liquid repellency treatments used on the substrate holder PH includecoating it with a fluororesin material or a liquid repellent material,such as acrylic resin material, or adhering a thin film consisting ofthe abovementioned liquid repellent material. Liquid repellent materialsused to impart liquid repellency include materials that are insoluble inthe liquid 1.

FIG. 4 is an enlarged cross sectional view of principle parts of thesubstrate stage PST, which holds the substrate P.

The ring shaped plate part 30 is installed inside the recessed part 32so that its outer circumference mates with the substrate table 52, andcomprises an inner circumferential surface 3, which is formed thinnerthan the thickness of the substrate P and opposes a side surface (outercircumferential part) PB of the substrate P, and an inclined surface(inclined part) 5, which has a starting point at a lower end part 4(first portion) of the inner circumferential surface 3 and slopesgradually downward toward the outer side. The upper end part 4 (i.e.,the lower end part of the inner circumferential surface 3) of theinclined surface 5 is disposed at a position higher than the upper endsurface 33A of the circumferential wall part 33 and the upper endsurfaces 34A of the support parts 34.

In the present embodiment, the flat surface 31 of the plate part 30 isliquid repellent with respect to the liquid 1, and the innercircumferential surface 3 and the inclined surface 5 of the plate part30 are lyophilic with respect to the liquid 1. The same processes usedin the substrate holder PH discussed above can be adopted for the liquidrepellency treatment of the flat surface 31. In addition, the innercircumferential surface 3 and the inclined surface 5 can belyophilically treated by, for example, ultraviolet light irradiation,plasma treatment that uses oxygen as the reaction gas and exposure to anozone atmosphere. Furthermore, the plate part 30 may be made of a liquidrepellent material (fluororesin and the like), and the innercircumferential surface 3 and the inclined surface 5 may be given theabovementioned lyophilic treatment, or provided with a lyophilic metal(or metal film) adhered thereto (or formed by film deposition).

In addition, a suction apparatus 60 is provided to the plate part 30that suctions the liquid that flows into a space 39, which is formedbetween the plate part 30 and the side surface PB of the substrate P. Inthe present embodiment, the suction apparatus 60 comprises: a tank 61that is capable of storing the liquid 1; a passageway 62, which isprovided inside the plate part 30 and the substrate table 52, thatconnects the space 39 and the tank 61; and a pump 64 that is connectedto the tank 61 via a valve 63. Furthermore, this passageway 62 is opento the space 39 in the vicinity of (below) a lower end part of theinclined surface 5, and the inner wall surface of the passageway 62 isalso given the abovementioned liquid repellency treatment.

The recovery apparatus according to the present invention comprises thesuction apparatus 60, as well as the lyophilic inner circumferentialsurface 3 and the inclined surface 5 of the plate part 30.

Furthermore, the front surface PA, which is the exposure surface of thesubstrate P, is coated with a photoresist (photosensitive material) 90.In the present embodiment, the photosensitive material 90 is aphotosensitive material (e.g., TARF-P6100 manufactured by Tokyo OhkaKogyo Co., Ltd.) for ArF excimer laser light, is liquid repellent (waterrepellent), and has a contact angle of approximately 70-80°. Inaddition, in the present embodiment, the side surface PB of thesubstrate P is given liquid repellency treatment (water repellencytreatment). Specifically, the side surface PB of the substrate P is alsocoated with the abovementioned liquid repellent photosensitive material90. Furthermore, the rear surface PC of the substrate P is also givenliquid repellency treatment by coating it with the abovementionedphotosensitive material 90.

In addition, a V shaped notched part PV is formed in the outercircumference of the substrate P for aligning the substrate P (refer toFIG. 3). Furthermore, a cross section of the notched part PV is depictedin FIG. 4, and the outer circumference of the substrate beyond thenotched part PV is depicted by a chain double-dashed line. In this case,the gap between the substrate outer circumference beyond the notchedpart PV and the inner circumferential surface 3 of the plate part 30 is,for example, 0.3-0.5 mm, and the gap between the substrate outercircumference of the notched part PV and the inner circumferentialsurface 3 of the plate part 30 is, for example, 1.5-2.0 mm.

On the other hand, the substrate stage PST comprises a suction apparatus40 that supplies negative pressure to a space 38, which is surrounded bythe circumferential wall part 33 of the substrate holder PH. The suctionapparatus 40 comprises: a plurality of suction ports 41, which areprovided to the upper surface of the base part 35 of the substrateholder PH; a vacuum part 42, which includes a vacuum pump providedoutside of the substrate stage PST; and a passageway 43, which is formedinside the base part 35 and connects the vacuum part 42 to each of theplurality of suction ports 41. The suction ports 41 are provided at aplurality of prescribed locations different from the support parts 34 onthe upper surface of the base part 35. The suction apparatus 40 suctionsthe gas (air) inside the space 38 formed between the circumferentialwall part 33, the base part 35, and the substrate P, which is held bythe support parts 34, and holds the substrate P by suction to thecircumferential wall part 33 and the support parts 34 by creating anegative pressure in the space 38. The control apparatus CONT controlsthe operation of the recovery apparatus (suction apparatus 60) and thesuction apparatus 40.

The following explains the method by which the exposure apparatus EX,having the constitution discussed above, performs immersion exposure ofan edge area E of the substrate P.

When performing immersion exposure of the edge area E of the substrate Pas depicted in FIG. 4, the liquid 1 of the immersion area AR2 isdisposed at part of the front surface PA of the substrate P and part ofthe flat surface 31 of the plate part 30. At this time, if the edge areaE to be exposed is at a position where the notched part PV of thesubstrate P is not provided, then, because the front surface PA of thesubstrate P and the flat surface 31 of the plate part 30 are givenliquid repellency treatment, and because a gap (hereinbelow, referred toas gap A) therebetween is not large, it is difficult for the liquid 1 ofthe immersion area AR2 to infiltrate the gap A and virtually no liquid 1flows therein due to the surface tension of the liquid 1.

On the other hand, if the edge area E to be exposed is at the notchedpart PV of the substrate P, then there is a possibility that the liquid1 will infiltrate the space 39 depicted in FIG. 4 because the gapbetween the outer circumference PB of the substrate P and the innercircumferential surface 3 of the plate part 30 increases to, forexample, approximately 2 mm.

Here, because the outer circumference PB of the substrate P is liquidrepellent and the inner circumferential surface 3 and the inclinedsurface 5 of the plate part 30 are lyophilic, the liquid 1 that flowsinto the space 39 moves (travels) from the inner circumferential surface3 to the inclined surface 5 due to its own weight and the force of theaffinity with the inner circumferential surface 3, and arrives at theopening part of the passageway 62. By continuously operating the pump 64of the suction apparatus 60, the negative pressure increases when theliquid 1 blocks the passageway 62, and the liquid 1 that arrives at theopening part thereof can consequently be suctioned into and recovered inthe tank 61 through the passageway 62. The tank 61 is provided with adischarge passageway 61A, which discharges the liquid 1 when aprescribed amount has accumulated.

Furthermore, even in the event that the liquid 1 travels around to therear surface PC of the substrate P, it is possible to prevent theinfiltration of the liquid 1 into the space 38 from the gap between therear surface PC and the circumferential wall part 33 because the rearsurface PC and the upper end surface 33A of the circumferential wallpart 33 are liquid repellent.

In addition, the inside of the recessed part 32 is open to atmosphericpressure; consequently, the pressure therein is held at a constant levelin the state wherein the liquid 1 does not block the passageway 62,vibrations attendant with the suction operation are not transmitted tothe substrate P, and it is therefore possible to prevent adverse effectsdue to those vibrations.

In addition, a gap is formed in the plate part 30 between the recoverymembers 23, 24 of the liquid recovery mechanism 20, but the flat surface31 is liquid repellent and it is therefore possible to prevent theliquid 1 from flowing out of this gap and to avoid hindering theexposure process.

Thus, the present embodiment prevents the liquid 1 from traveling aroundto the space between the substrate P and the holder PH (thecircumferential wall part 33), even when exposing the edge area E of thesubstrate P, and it is therefore possible to perform immersion exposurewhile satisfactorily holding the liquid 1 below the projection opticalsystem PL. Particularly, with the present embodiment, the liquid 1 thatflows into the space 39 can be easily recovered using the innercircumferential surface 3 and the inclined surface 5, which arelyophilic parts, to guide the liquid 1 to the passageway 62 of thesuction apparatus 60, which is at a position spaced apart from thesubstrate P, and it is therefore possible to prevent the liquid 1 fromtraveling around the notched part PV and to satisfactorily performimmersion exposure, even if using a substrate P wherein a notched partPV for alignment is formed. Furthermore, with the present embodiment,the upper end part 4 of the inclined surface 5 is positioned higher thanthe upper end surface 33A, which is the substrate holding surface, andit is consequently possible to guide the liquid 1 that flows into thespace 39 to the inclined surface 5 before it reaches the upper endsurface 33A, thereby making the suctioning and recovery of the liquid 1more reliable.

In addition, with the present embodiment, the side surface 37 and theupper end surface 33A of the circumferential wall part 33 of thesubstrate holder PH are liquid repellent, and it is therefore possibleto prevent the infiltration of the liquid 1 into the space 38, even ifthe liquid 1 travels around to the rear surface side of the substrate P.In addition, because the flat surface 31 of the plate part 30 is givenliquid repellency treatment, the liquid 1 that forms the immersion areaAR2 is prevented from excessively spreading to the outer side of theplate part 30, which makes it possible to satisfactorily form theimmersion area AR2 and prevent problems such as the outflow, dispersion,and the like of the liquid 1.

Second Embodiment

FIG. 5 and FIG. 6 depict the second embodiment of the stage apparatus ofthe present invention.

With the first embodiment, the liquid 1 travels to the inclined surfaceof the plate part 30 due to its own weight, and is guided in a directionaway from the substrate P; however, the second embodiment adopts aconstitution wherein the liquid 1 is suctioned using the capillaryphenomenon.

The following explanation is made referencing FIG. 5 and FIG. 6.

Furthermore, constituent elements in FIG. 5 and FIG. 6 that areidentical to those in the first embodiment, which is depicted in FIG. 4and the like, are assigned the identical symbols, and the explanationsthereof are omitted.

As depicted in FIG. 5, the plate part 30 in the present embodimentcomprises a rear surface 7 extending in the horizontal direction(substantially parallel to the substrate holding surface 33A) from thelower end part 4, which serves as a base end, of the innercircumferential surface 3. A plurality of slits (recessed parts) 8 isprovided to the rear surface 7, wherein one end of each slit 8 is opento the space 39 formed between the side surface PB of the substrate Pand the inner circumferential surface 3.

As depicted in the partial enlarged plan view of FIG. 6, each slit 8 hasa minute width, and the slits 8 are radially formed at prescribedintervals around the entire circumference of the inner circumferentialsurface 3. Furthermore, the opening part of the passageway 62 of thesuction apparatus 60 is disposed at the tip parts of the slits 8. Thebottom surface 7 that includes the slits 8 is given the abovementionedlyophilic treatment, and is therefore lyophilic.

Furthermore, to facilitate understanding, FIG. 6 depicts a state whereinthe number of slits 8 is reduced, but actually numerous slits 8 areformed at a micropitch so that the liquid 1 can be effectivelysuctioned.

Other aspects of the constitution of the present embodiment are the sameas the abovementioned first embodiment.

With the present embodiment, the liquid 1 that flows into the space 39is sucked into the slits 8 by the force of its affinity therewith and bythe capillary phenomenon, and is suctioned and recovered from the endparts of the slits 8 through the passageway 62; consequently, the liquid1 can be prevented from traveling around to the rear surface side of thesubstrate P, and an immersion exposure can be satisfactorily performed.

Furthermore, a constitution wherein the slits of the present embodimentare adapted to the inclined surface 5 in the first embodiment would alsobe suitable. In this case, the suction force due to the capillaryphenomenon is added to the self weight of the liquid 1, which raises thesuction force and enables more reliable suctioning and recovery thereof.

Third Embodiment

FIG. 7 depicts the third embodiment of the stage apparatus of thepresent invention.

With the present embodiment, the liquid 1 is suctioned and recoveredusing the lyophilic parts and the suction pressure differential withrespect to the plate part 30 and the substrate P.

The following explanation is made referencing FIG. 7.

Furthermore, in FIG. 7, constituent elements that are identical to thosein the first embodiment, which is depicted in FIG. 4 and the like, areassigned the identical symbols, and the explanations thereof areomitted.

As depicted in FIG. 7, the plate part 30 in the present embodiment isformed in a ring plate shape, and is mounted and fixed onto thesubstrate table 52. A groove 9, which is upwardly open, is formed in thesubstrate table 52 around its entire circumference at a position whereinit is covered by the plate part 30. Furthermore, the passageway 62 ofthe suction apparatus 60 is provided to the substrate table 52, andconnects the groove 9 and the tank 61. In addition, a step part 52A,which forms a micro gap between the substrate table 52 and the rearsurface 7 of the plate part 30, is formed on the inner circumferentialside of the groove 9 in the substrate table 52, and the groove 9 and thespace 39 are in communication through this gap. The step part 52A andthe rear surface 7 of the plate part 30 are lyophilic parts that havebeen given the lyophilic treatment discussed above.

With the exposure apparatus EX constituted as mentioned above, thecontrol apparatus CONT controls the suction apparatuses 40, 60 so thatthe negative pressure suction force that applies suction to the interiorof the groove 9 is greater than the negative pressure suction force thatsuctions the space 38 in order to hold the substrate P to the substrateholder PH. Accordingly, if the liquid 1 flows into the space 39, thenegative pressure in the groove 9 (the plate part 30 side) is greaterthan the negative pressure in the space 38 (the substrate holder PHside), and consequently the liquid 1 is suctioned into the groove 9through the gap between the rear surface 7 of the plate part 30 and thestep part 52A of the substrate table 52, and is further suctioned intoand recovered in the tank 61 through the passageway 62. Particularly,with the present embodiment, the rear surface PC of the substrate P andthe upper end surface 33A of the substrate holder PH (thecircumferential wall part 33) are liquid repellent, whereas the rearsurface 7 of the plate part 30 and the step part 52A of the substratetable 52 are lyophilic, and it is consequently possible to easilysuction and reliably recover the liquid 1 to the plate part 30 side bythe force of their affinity to the liquid 1.

Furthermore, with the abovementioned first embodiment, the plate part 30comprises the lyophilic inner circumferential surface 3 and the inclinedsurface 5, but the present invention is not limited thereto; as depictedin FIG. 8, the inner circumferential surface 3 may be formed across theentire thickness of the plate part 30, without forming the inclinedsurface. In this case, the inner circumferential surface 3 is givenlyophilic treatment, and may be provided with the opening part of thepassageway 62 of the suction apparatus 60.

With the abovementioned constitution, the liquid 1 that flows into thespace 39 travels to the inner circumferential surface 3 due to its ownweight and its lyophilicity with the inner circumferential surface 3,and is suctioned into and recovered in the tank 61 through thepassageway 62, consequently the same effects as those in theabovementioned first embodiment are obtained.

Furthermore, the entire surface of the flat surface 31 of the plate part30 in the abovementioned embodiments does not need to be liquidrepellent, but at least the position opposing the first and secondrecovery members 23, 24 of the liquid recovery mechanism 20 should beliquid repellent. In addition, the entire surface of the substrateholder PH as well does not need to be liquid repellent, but the upperend surface 33A of the circumferential wall part 33 that opposes therear surface PC of the substrate P as well as the side surface 37 thatopposes the plate part 30 (space 39) should be liquid repellent.

Likewise for hydrophilicity, the slits 8 in the second embodiment, forexample, should be lyophilic, but the rear surface 7 does notnecessarily need to be so.

In addition, the entire surfaces of the front surface PA, the sidesurface PB, and the rear surface PC of the substrate P in theabovementioned embodiments is coated with the photosensitive material 90in order to give them liquid repellency treatment, but a constitutionmay be adopted wherein only the side surface PB of the substrate P andthe area of the rear surface PC of the substrate P that opposes thecircumferential wall part 33 are given liquid repellency treatment.

The side surface PB and the rear surface PC of the substrate P arecoated with a liquid repellent photosensitive material 90 as the liquidrepellency treatment, but they may be coated with a liquid repellent(water repellent) prescribed material other than the photosensitivematerial 90. For example, there are cases wherein the upper layer of thephotosensitive material 90, which is coated on the front surface PA thatis the exposure surface of the substrate P, is coated with, for example,a protective layer (a film that protects the photosensitive material 90from the liquid) called a topcoat layer, and the material that formsthis topcoat layer (e.g., fluororesin material) is liquid repellent(water repellent) at a contact angle of, for example, approximately110°. Accordingly, the side surface PB, the rear surface PC of thesubstrate P are coated with this topcoat layer forming material. Ofcourse, they may be coated with a liquid repellent material other thanthe photosensitive material 90 and the topcoat layer forming material.

Likewise, it was explained that, as the liquid repellency treatment, thesubstrate stage PST and the substrate holder PH may be coated with afluororesin material or an acrylic resin material but they may be coatedwith the abovementioned photosensitive material or the topcoat layerforming material; conversely, the side surface PB and the rear surfacePC of the substrate P may be coated with the material used in the liquidrepellency treatment of the substrate stage PST and the substrate holderPH.

It is often the case that the abovementioned topcoat layer is providedin order to prevent the infiltration of the liquid 1 of the immersionarea AR2 into the photosensitive material 90; however, even if anadhered residue (a so-called watermark) of the liquid 1 is formed, forexample, on the topcoat layer, eliminating the topcoat layer after theimmersion exposure can eliminate the watermark together with the topcoatlayer, and the subsequent prescribed process, such as the developmentprocess, can then be performed. Here, if the topcoat layer is made of,for example, a fluororesin material, then it can be eliminated using afluorine based solvent. Thereby, there is no longer a need forapparatuses and the like (e.g., a substrate cleaning apparatus forremoving watermarks) in order to eliminate the watermark, and theprescribed processes can be satisfactorily performed after the watermarkhas been eliminated by a simple constitution that eliminates the topcoatlayer with a solvent.

In addition, the abovementioned embodiments explained that a notchedpart, which is V shaped in a plan view, is provided for aligning thesubstrate P, but the present invention can also be adapted to asubstrate provided with a so-called orientation flat, wherein thesubstrate P is notched in a direction orthogonal to the radialdirection, and of course can also be adapted to a substrate wherein anotched part for alignment is not formed.

The liquid 1 in each of the abovementioned embodiments comprises purewater. Pure water is advantageous because it can be easily obtained inlarge quantities at a semiconductor fabrication plant and the like, andbecause pure water has no adverse impact on the optical elements(lenses), the photoresist on the substrate P, and the like. In addition,because pure water has no adverse impact on the environment and has anextremely low impurity content, it can also be expected to have theeffect of cleaning the surface of the substrate P and the surface of theoptical element provided on the tip surface of the projection opticalsystem PL. Furthermore, PFPE (fluoropolyether) may be used as the liquid1.

Further, because the refractive index n of pure water (water) for theexposure light EL that has a wavelength of approximately 193 nm issubstantially 1.44, the use of ArF excimer laser light (193 nmwavelength) as the light source of the exposure light EL would shortenthe wavelength on the substrate P to 1/n, i.e., approximately 134 nm,thereby obtaining a high resolution. Furthermore, because the depth offocus will increase approximately n times, i.e., approximately 1.44times, that of in air, the numerical aperture of the projection opticalsystem PL can be further increased if it is preferable to ensure a depthof focus approximately the same as that when used in air, and theresolution is also improved from this standpoint.

In the present embodiment, the optical element 2 is attached to the tipof the projection optical system PL, and this lens can adjust theoptical characteristics, e.g., aberrations (spherical aberration, comaaberration, and the like), of the projection optical system PL.Furthermore, the optical element attached to the tip of the projectionoptical system PL may be the optical plate used to adjust the opticalcharacteristics of the projection optical system PL. Alternatively, itmay be a parallel plate capable of transmitting the exposure light EL.

Furthermore, if the pressure generated by the flow of the liquid 1between the optical element 2 at the tip of the projection opticalsystem PL and the substrate P is high, then the optical element 2 may berigidly fixed so that it does not move by that pressure, instead ofmaking that optical element 2 exchangeable.

In addition, the present embodiment is constituted so that the liquid 1is filled between the projection optical system PL and the surface ofthe substrate P, but it may be constituted so that, for example, theliquid 1 is filled in a state wherein a cover glass, comprising aparallel plate, is attached to the surface of the substrate P.

Furthermore, although the liquid 1 in the present embodiment is water,it may be a liquid other than water. For example, if the light source ofthe exposure light EL is an F₂ laser, then the F₂ laser light will nottransmit through water, so it would be acceptable to use as the liquid 1a fluorine based fluid, such as fluorine based oil, that is capable oftransmitting F₂ laser light. In addition, it is also possible to use asthe liquid 1 a liquid (e.g., cedar oil) that is transparent to theexposure light EL, has the highest possible refractive index, and isstable with respect to the projection optical system PL and to thephotoresist coated on the surface of the substrate P. In this case aswell, the surface treatment is performed in accordance with the polarityof the liquid 1 used.

Furthermore, the substrate P in each of the abovementioned embodimentsis not limited to a semiconductor wafer for fabricating semiconductordevices, and is also applicable to a glass substrate for a displaydevice, a ceramic wafer for a thin film magnetic head, or a mask ororiginal plate of a reticle (synthetic quartz, silicon wafer) used by anexposure apparatus, and the like.

In addition to a step-and-scan system scanning type exposure apparatus(scanning stepper) that scans and exposes the pattern of the mask M bysynchronously moving the mask M and the substrate P, a step-and-repeatsystem projection exposure apparatus (stepper) that exposes the fullpattern of the mask M, with the mask M and the substrate P in astationary state, and sequentially steps the substrate P is alsoapplicable as the exposure apparatus EX. In addition, the presentinvention is also applicable to a step-and-stitch system exposureapparatus that transfers at least two patterns partially andsuperimposingly onto the substrate P.

In addition, the present invention is also applicable to the twin stagetype scanning steppers disclosed in Japanese Unexamined PatentApplication, First Publication No. H10-163099, Japanese UnexaminedPatent Application, First Publication No. H10-214783, Published JapaneseTranslation No. 2000-505958 of the PCT International Publication, andthe like.

The type of exposure apparatus EX is not limited to semiconductor devicefabrication exposure apparatuses that expose the pattern of asemiconductor device on the substrate P, but is also widely applicableto exposure apparatuses for fabricating liquid crystal display devicesor displays, for fabricating thin film magnetic heads, imaging devices(CCDs), reticles and masks, and the like.

If a linear motor (refer to U.S. Pat. No. 5,623,853 and U.S. Pat. No.5,528,118) is used in the substrate stage PST or the mask stage MST,then either an air levitation type, which uses an air bearing, or amagnetic levitation type, which uses Lorentz's force or reactance force,may be used. In addition, each of the stages PST, MST may be a type thatmoves along a guide or may be a guideless type.

For the drive mechanism of each of the stages PST, MST, a planar motormay be used that opposes a magnet unit, wherein magnets are disposed twodimensionally, to an armature unit, wherein coils are disposed twodimensionally, and drives each of the stages PST, MST by electromagneticforce. In this case, either the magnet unit or the armature unit isconnected to the stages PST, MST and the other one, which is either themagnet unit or the armature unit, should be provided on the movingsurface side of the stages PST, MST.

The reaction force generated by the movement of the substrate stage PSTmay be mechanically discharged to the floor (ground) using a framemember so that it is not transmitted to the projection optical systemPL, as recited in Japanese Unexamined Patent Application, FirstPublication No. H08-166475 (U.S. Pat. No. 5,528,118).

The reaction force generated by the movement of the mask stage MST maybe mechanically discharged to the floor (ground) using a frame member sothat it is not transmitted to the projection optical system PL, asrecited in Japanese Unexamined Patent Application, First Publication No.H08-330224 (U.S. Pat. No. 5,874,820). In addition, the reaction forcemay be eliminated by using the law of the conversation of momentum, asrecited in Japanese Unexamined Patent Application, First Publication No.8-63231 (U.S. Pat. No. 6,255,796).

The exposure apparatus EX of the embodiments in the present applicationis manufactured by assembling various subsystems, including eachconstituent element recited in the claims of the present application, sothat prescribed mechanical, electrical, and optical accuracies aremaintained. To ensure these various accuracies, adjustments areperformed before and after this assembly, including an adjustment toachieve optical accuracy for the various optical systems, an adjustmentto achieve mechanical accuracy for the various mechanical systems, andan adjustment to achieve electrical accuracy for the various electricalsystems. The process of assembling the exposure apparatus from thevarious subsystems includes the mutual mechanical connection of thevarious subsystems, the wiring and connection of electrical circuits,the piping and connection of the pneumatic circuit, and the like.Naturally, before process of assembling the exposure apparatus fromthese various subsystems, there are also the processes of assemblingeach individual subsystem. When the process of assembling the exposureapparatus from the various subsystems is finished, a comprehensiveadjustment is performed to ensure the various accuracies of the exposureapparatus as a whole. Furthermore, it is preferable to manufacture theexposure apparatus in a clean room wherein the temperature, thecleanliness level, and the like are controlled.

As shown in FIG. 9, a micro-device, such as a semiconductor device ismanufactured by: a step 201 that designs the functions and performanceof the micro-device; a step 202 that fabricates a mask (reticle) basedon this design step; a step 203 that fabricates a substrate, which isthe base material of the device; an exposure processing step 204 whereinthe exposure apparatus EX of the embodiments discussed above exposes apattern of the mask onto the substrate; a device assembling step 205(comprising a dicing process, a bonding process, and a packagingprocess); an inspecting step 206; and the like.

While preferred embodiments of the invention have been described andillustrated above, it should be understood that these are exemplary ofthe invention and are not to be considered as limiting. Additions,omissions, substitutions, and other modifications can be made withoutdeparting from the spirit or scope of the present invention.Accordingly, the invention is not to be considered as being limited bythe foregoing description, and is only limited by the scope of theappended claims.

What is claimed is:
 1. An exposure apparatus that exposes a substratethrough a liquid with a light from a projection optical system, theexposure apparatus comprising: a stage which has a substrate holder thatholds the substrate and a plate member provided around the substrateholder so as to surround the substrate on the substrate holder and whichis movable relative to the projection optical system; a liquid supplymechanism which includes a supply port arranged above the stage so as tobe face-to-face with the stage at a more outward position than anoptical path of the light from the projection optical system withrespect to an optical axis of the projection optical system and whichsupplies the liquid onto the stage from the supply port; and a liquidrecovery mechanism which includes a recovery port arranged above thestage so as to be face-to-face with the stage at a more outward positionthan the supply port with respect to the optical axis and whichrecovers, from the recovery port, a liquid supplied from the supplyport, wherein the liquid supply mechanism and the liquid recoverymechanism form a liquid immersion region so as to include the opticalpath on part of the stage with a liquid supplied from the supply port,and the stage has a passageway provided below the plate member andrecovers, by the passageway, the liquid that infiltrates a gap betweenthe plate member and the substrate by moving with respect to the liquidimmersion region in a state where the substrate is held by the substrateholder.
 2. The exposure apparatus according to claim 1, wherein thestage has a facing surface provided below the gap so as to beface-to-face with the gap and recovers the liquid that infiltrates thegap via the facing surface by the passageway.
 3. The exposure apparatusaccording to claim 2, wherein part of the facing surface is face-to-facewith a rear surface of the plate member.
 4. The exposure apparatusaccording to claim 2, wherein an opening of the passageway is providedbelow the plate member.
 5. The exposure apparatus according to claim 2,wherein an opening of the passageway is provided so as to beface-to-face with a rear surface of the plate member.
 6. The exposureapparatus according to claim 2, wherein an opening of the passageway isprovided at a more outward position than the facing surface with respectto the substrate holder.
 7. The exposure apparatus according to claim 1,wherein the substrate holder is arranged in a recessed part formed onthe stage, and an opening of the passageway is provided at a higherposition than a bottom surface of the recessed part.
 8. The exposureapparatus according to claim 1, wherein the substrate holder holds thesubstrate such that an upper surface of the plate member is at a sameheight as an upper surface of the substrate.
 9. The exposure apparatusaccording to claim 1, wherein the plate member is formed in a ring shapeso as to surround the substrate holder.
 10. The exposure apparatusaccording to claim 1, wherein the plate member is liquid repellent. 11.The exposure apparatus according to claim 1, wherein the projectionoptical system includes a lens provided at a tip part on the stage sideso as to come into contact with the liquid immersion region.
 12. Theexposure apparatus according to claim 11, wherein a contact surface,which comes into contact with the liquid immersion region, of a surfaceof the lens is lyophilic.
 13. A device manufacturing method that forms adevice on a substrate, the method comprising: exposing the substrateusing the exposure apparatus according to claim 1; and developing thesubstrate exposed using the exposure apparatus.